Tooling and Fixtures include precision component machining, SMT/DIP reflow oven carriers, in-line ICT (In-Circuit Test), and FCT (Functional Circuit Test) for product validation.
Semiconductor packaging process includes critical process tooling and fixtures used to protect, electrically connect, and thermally manage chips (dies) on a wafer during manufacturing, and ultimately form standalone components installable in electronic devices; CSP (Chip Scale Package) special boats; and WB (Wire Bonding) bonding auxiliary pressure plates.
Customized products include magazines, chip test and packaging equipment, and accessories.
New display solutions include products and services such as Mini LED chip transfer carriers and chip module test tooling.
自动化事业部涉及自动化方案提供、设计、组装、调试、安装、培训和服务，自动化标准机升级销售。公司具备可实现报告分析、程序编写、系统集成等，产品主要含括自动化测试和检测机、自动化传输组装线体、自动化组装设备。公司逐步成为电子制造业设备“一站式”服务商。
The Automation Division is involved in providing, designing, assembling, debugging, installing, training, and servicing automation solutions. It also engages in the upgrade and sales of standard automation machines. The company is capable of achieving report analysis, program writing, and system integration. Its products mainly include automated testing and inspection machines, automated transfer and assembly lines, and automated assembly equipment. The company is gradually becoming an "one-stop" service provider for electronic manufacturing equipment.
